data sheet lvy3330/t-pf/tbs-x ligitek electronics co.,ltd. property of ligitek only lvy3330/t-pf/tbs-x - 2008 doc. no : qw0905- rev. : date : 23 - may. a lead-free parts pb tape and box type led lamps
- + 5.0 7.6 8.6 25.0min 5.9 + - 1.0min 2.54typ h w2 p1 p f t d w1 w3 h1 l w0 p2 h2 0.5 typ 1.5max 1/6 part no. lvy3330/t-pf/tbs-x ligitek electronics co.,ltd. property of ligitek only page package dimensions lvy3330/t-pf note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice.
2/6 page unit ma ratings 30 vy ma mw a 75 10 60 -40 ~ +100 -40 ~ +85 typ. 5036 max. 2 min. 2.2 20 1.8 min. 38 viewing angle 2 1/2 (deg) forward voltage @ ma(v) spectral halfwidth nm luminous intensity @2ma(mcd) absolute maximum ratings at ta=25 symbol i f parameter pd ir i fp power dissipation reverse current @5v peak forward current duty 1/10@10khz forward current tstg storage temperature t opr operating temperature lens 590 emitted material yellow algainp color yellow diffused dominant wave length dnm part no lvy3330/t-pf/tbs-x note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. typical electrical & optical characteristics (ta=25 ) ligitek electronics co.,ltd. property of ligitek only electrostatic discharge( * ) esd2000 v static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * part no. lvy3330/t-pf/tbs-x
ligitek electronics co.,ltd. property of ligitek only 4.2 mm maximum 0.17 inch 2.0 22.5 18.5 25.0 23.5 20.9 26.5 0.98 1.04 0.82 0.93 0.73 0.89 0.08 3.00.12 inch 0.15 mm 3.8 minimum d ------- symbol ------- 0.85 0.69 ------- 21.5 17.5 0.89 0.94 0.78 22.5 24.0 19.9 25.51.0 h ------- h1 2.3 f ------- 0.09 specifications symbol items dimension symbol information ? component lead pitch feed hole to bottom of component front-to-rear deflection tape feed hole diameter tbs-7 tbs-3 tbs-6 tbs-5 tbs-1 tbs-2 option code 19.4 22.0 20.0 11 36 19.0 21.5 0.75 1.42 0.43 0.76 0.85 0.87 0.79 5.8 1.42 7.7 9.75 15.5 4.0 19 0.38 0.75 0.16 0.61 0.23 0.3 0.06 130.51 0.75 0.83 0.72 19.0 21.0 18.4 0.71 ------- 18.0 ------- w0 20.50.81 l h2 ------- ------- 0.17 ------- 0.2 4.4 ------- 5.1 0.33 0.57 0 0.69 14.5 8.5 0 17.5 p1 t p2 ------- ------- ------- w0 w1 w3 w2 ------- ------- ------- ------- 12.4 ------- p 0.49 mm 34013.4 inch maxmum 2.4 60 27510.8 package dimensions ? feed hole location tape width adhesive tape position adhesive tape width feed hole to overall component height lead length after component height overall taped package thickness center of component location lead location feed hole pitch inch 13.0 mm 330 minimum l symbol 1.97 50 h 265 w 10.4 quantity/box overall length overall thickness overall width description dimensions symbol information ? 2000pcs specification remark:tbs=tape and box straight leads tbs-13 tbs-10 tbs-12 tbs-11 tbs-9 24.5 tbs-80.9625.51.0 page 3/6 part no. lvy3330/t-pf/tbs-x
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600 0.0 0.5 1.0 1.52.02.53.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 650 typical electro-optical characteristics curve vy chip page 4/6 75% 50% 75% 100%25%050% 25% -30 -60 0 30 100% 60 fig.6 directivity radiation part no. lvy3330/t-pf/tbs-x
60 seconds max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 5 /sec max note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 0 0 25 120 preheat 50 100 2 /sec max temp( c) 260 260 c3sec max time(sec) 150 ligitek electronics co.,ltd. property of ligitek only soldering condition 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) 2.wave soldering profile page 5/6 part no. lvy3330/t-pf/tbs-x
page 6/6 reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 test itemtest condition operating life test reliability test: 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) low temperature storage test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. description ligitek electronics co.,ltd. property of ligitek only mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 solder resistance test 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles thermal shock test high temperature high humidity test solderability test 1.t.sol=230 5 2.dwell time=5 1sec this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. this test intended to see soldering well performed or not. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. the purpose of this test is the resistance of the device under tropical for hours. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs part no. lvy3330/t-pf/tbs-x
|
